Intel Xeon W-2123 processor
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3.6 GHz
8.25 MB cache and 4 cores
Up to 3.9 GHz with Intel Turbo Boost Technology
Supports DDR4 memory up to 2666 MT/s data rate
120 W
Supports Intel vPro technology
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Ports/slots/bays
Specifications
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Description
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Input/output ports
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Front I/O (base)
(4) USB 3.1 Gen 1 Type-A (1 charging)
(1) Headset audio port
Front I/O (optional)
(1) Optional media card reader
Front I/O (optional premium)
(2) USB 3.1 Gen 1 Type-A connector (1 charging)
(2) USB 3.1 Gen 2 Type-C connector
(1) Headset headset
(1) Power button with power/fault LED
(1) Drive activity LED
Internal I/O
(1) USB 3.1 Gen 1 (aka USB 3.0) single-port header
(1) USB 2.0 single-port header
(1) USB 2.0 dual-port header
Rear I/O (for Xeon W configurations)
(6) USB 3.1 Gen 1 (aka USB 3.0) Type-A ports
(2) 1 Gbe LAN ports (1x supporting Intel AMT)
Rear I/O (for Core X configurations)
(5) USB 3.1 Gen 1 (aka USB 3.0) Type-A ports
(1) 1 Gbe LAN ports (1x supporting Intel AMT)
Rear I/O (common)
(1) Audio line-out
(1) Audi line-in (line-in can be retasked as microphone)
(1) PS/2 mouse
(1) PS/2 keyboard
(1) Rear power button
(1) serial port (cable up to rear bulkhead)
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Expansion slots
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Slot 0 (mechanical only)
Only for rear bulkhead mounting
Slot 1
PCI Express Gen 3 x16 (from CPU)
Slot 2
PCI Express Gen 3 x16 (from PCH) with open-ended connector
Slot 3 (for Xeon W)
PCI Express Gen 3 x16 (from CPU)
Slot 3 (for Core i9-X)
PCI Express Gen 3 x16
Slot 3 (for Core i7-X)
PCI Express Gen 3 x16 (from CPU) mechanical
PCI Express Gen 3 x8 (from CPU) electrical
Slot 4
PCI Express Gen 3 x16 (from PCH) with open-ended connector
Slot 5
PCI Express Gen 3 x8 (from CPU)
Slot 5 (for Core i9-X)
PCI Express Gen 3 x8 (from CPU)
Slot 5 (for Core i7-X)
PCI Express Gen 3 x8 (from CPU) mechanical
M.2 Slot 1
M.2 PCIe Gen 3 x4 – CPU up to 80 mm (3.15 in) storage devices
M.2 Slot 2 (for Xeon W)
M.2 PCIe Gen 3 x4 – CPU up to 80 mm (3.15 in) storage devices
M.2 Slot 2 (for Core X)
M.2 connector/slot not available
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Expansion bays
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(2) Internal 8.89 cm (3.5 in) bays
(2) External 13.33 cm (5.25 in) bays
(1) 9.5 mm (0.37 in) slim optical disk drive bay
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Networking/communication
Feature
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Description
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Communications
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Intel Wi-Fi 6 AX200 & BT PCIe
HP i350-T2 PCIe Dual Port Gigabit NIC
Intel i350-T4 PCIe 4-Port Gigabit NIC
Intel Ethernet I210-T1 PCIe x1 Gb NIC
Aquantia NBASE-T 5GbE PCIe NIC
Intel X550-T2 10GbE Dual Port NIC
Intel X710-DA2 10GbE SFP+ Dual Port NIC (Windows 7 is not supported)
Intel 8265 802.11a/b/g/n/ac with Bluetooth PCIe WLAN
HP 10GbE SFP+ SR Transceiver
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Software/security
Specification
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Description
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Software
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Sobey video editing software
HP Remote Graphics Software
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BIOS
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Standard BIOS 32-bit Service Directory Proposal v0.4
PCI Local Bus specification, revision 2.3
PCI Power Management specification, revision 1.1
PCI Firmware specification, revision 3.0, draft .7
PCI Express Base specification, revision 2.0
PCI Express Base specification, revision 3.0
POST Memory Manager specification, version 1.01
ATAPI Removable Media Device BIOS specification version 1.0
WMI support
BIOS Boot spec 1.01+ (disables the ability to boot from removable media on supported devices)
UEFI 2.5
ACPI version 5.0
Enhanced Host Controller Interface for Universal Serial Bus, revision 1.0
LANDesk Management Suite (HP recommended solution)
Microsoft System Center Configuration Manager
HP Client Automation Enterprise
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Security
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Software
Trusted Computing Group
TPM specification version 2.0
Infineon SLB 9665 (Common Criteria EAL4+ certified)
Remote wakeup/remote shutdown
Memory change alert
Thermal alert
Hardware
Security cable with Kensington lock (optional)
HP Z4/Z6 Side panel barrel keylock
HP Solenoid Lock/hood Sensor
HP Z4/Z6 Depth Adjustable Fixed Rail Rack Kit
HP Keyed Cable Lock 10 mm
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Workstation ISV certifications
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Go to the Workstation ISV certifications webpage to see current certifications
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NOTE:
HP Cloud Recovery download tool (Cloud Recovery Client) is available under Software and Drivers section on the support page.
Power
Specifications
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Description
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Power supply
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Entry (Xeon series)
465 W
90% Efficient wide-ranging, active Power Factor Correction (PFC)
Mid-Range (Xeon series)
750 W
90% Efficient wide-ranging, active Power Factor Correction (PFC)
High-End (Xeon and Core i9 series)
1000 W
90% Efficient wide-ranging, active Power Factor Correction (PFC)
Includes 4x 6+2-pin graphics power cables
Includes a Front Fan and Card Guide kit to enable support for dual high end graphics solutions
High-End (Core i7 series)
1000 W
Includes a Front Fan and Card Guide kit to enable support for dual high end graphics solutions
Includes 2x 6+2-pin graphics power cables
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Buttons
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(1) Front power button and LED
(1) Rear power button
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Physical specifications
Specifications
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Description
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Dimensions (H x W x D)
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38.61 x 16.89 x 44.45 cm (15.2 x 6.65 x 17.5 in)
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Rack dimensions
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4U
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Weight
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Minimum
10.2 kg (22.49 lb)
Typical
11.3 kg (24.91 lb)
Maximum
17.3 kg (38.14 lb)
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Environmental specifications
Feature
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Description
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Certifications
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US ENERGY STAR (select models only)
Low Halogen
US Federal Energy Management Program (FEMP)
China Energy Conservation Program
The ECO declaration (TED)
EPEAT Gold registered where applicable (registration varies by country/region)
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Temperature
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Operating
5° to 35°C (41° to 95°F)
Non-operating
-40° to 60°C (40° to 140°F)
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Humidity
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Operating
10% to 85% (non-condensing, 35° C maximum wet bulb)
Non-operating
10% to 90% (non-condensing, 35° C maximum wet bulb)
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Altitude (unpressurized)
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Operating
3,048 m (10000 ft)
Non-operating
9,144 m (30000 ft)
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